Printed Circuit Boards

THERMAL CONDUCTIVE / HEAT DISSIPATING PRODUCT

• Silicon free
• Epoxy based
• High Tg(169°C)
• Very low CTE
• a1-14 ppm
• a2-45 ppm
• Single-Component
• Screen Print or Via Fill Application
• Thermally Cured
• Thermal Conductivity > 10W/mK
• Low outgassing
• Halogen free