| PSR-4000 AUS5 |
- Designed for BGA and Chip Scale Packages
- Excellent Resistance to ENIG and Immersion Tin
- Low Water Absorption
- Excellent Thermal and Crack Resistance
- Fine Dam Resolution
- Hard Surface Finish
- RoHS Compliant and Lead-free Compatible
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| PSR-4000 AUS21 |
- Designed for Polyimide Film for TAB-BGA Packages
- Low Warpage
- Excellent Resistance to ENIG
- Low Halogen and Low Misting
- Fine Dam Resolution
- RoHS Compliant and Lead-free Compatible
|
| PSR-4000 AUS320 |
- Designed for BGA and Chip Scale Packages
- Improved Thermal and Crack Resistance
- Low Halogen and Low Misting
- Excellent Resistance to ENIG and Immersion tin
- Low Water Absorption and Excellent HAST Resistance
- Fine Dam Resolution
- Adhesion to Molding Compounds
- RoHS Compliant and Lead-free Compatible
|
| PSR-4000 AUS703 |
- Designed Specifically for Flip Chip Packages
- Improved Thermal and Crack Resistance
- Low Halogen and Low Misting
- Excellent Resistance to ENIG and Immersion Tin
- Low Water Absorption
- Fine Dam Registration
- RoHS Compliant and Lead-free Compatible
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