| THP-100DX1 (HTG) |
- Highest Tg (173°C) and Lowest CTE (19/56 ppm) Available On the Market
- 100% Solids for Extremely Low Shrinkage
- No Chemical Attack through Desmear
- Halogen Free and RoHS Compliant
- High PCT and Thermal Resistance
- Designed Specifically for ITC Hole Filling Equipment; to Fill Small Vias Without Voids and Sagging
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| THP-100DX1 (GF) |
- Used to Fill High Copper Inner Layers to Achieve a Planar Outer Layer
- Screen Print Application with Flame Resistant Properties
- High Tg (160°C) and Low CTE (32/115 ppm)
- Very Low Shrinkage and Ease of Planarization
- No Chemical Attack through Desmear
- Halogen-Free and RoHS Compliant
- Excellent Adhesion Between Layers
- Compatible with Lead-Free Processing
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| THP-100DX1 |
- Single-Component Thermal Cure Hole Fill Material
- "SP" Version for Screen Print and "VF" Version for Machine Filling (Mass, ITC, etc.)
- Available in Air-Free Cartridges for Automatic Equipment or Standard Containers
- High Tg (160°C) Low CTE (32/115 ppm)
- Very Low Shrinkage
- Easy Planarization
- No Chemical Attack through Desmear
- Low Halogen and RoHS Compliant
- High PCT and Thermal Resistance
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| SCHP-7901 |
- Silver Conductive Hole Fill Material
- Single-Component
- Thermally Cured
- Good Reliability
- Compatible with Copper Plating
- Excellent Thermal Conductivity
- RoHS Compliant
- Low Halogen
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| UVHP-100 |
- UV Cure, One-Component Hole Fill Material
- For Plated or Non-Plated Holes
- Very Low Shrinkage
- Compatible with Solder Mask Top Coat
- RoHS Compliant
- Low Halogen
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