Phone: (775) 885-9959

 THP-100DX1
  • Single-Component Thermal Cure Hole Fill Material
  • “SP” Version for Screen Print and “VF” Version for Machine Filling (Mass, ITC, etc.)
  • Available in Air-Free Cartridges for Automatic Equipment or Standard Containers
  • High Tg (160°C) Low CTE (32/115 ppm)
  • Very Low Shrinkage
  • Easy Planarization
  • No Chemical Attack through Desmear
  • Halogen-Free and RoHS Compliant
  • High PCT and Thermal Resistance
 SCHP-7901
  • Silver Conductive Hole Fill Material
  • Single-Component
  • Thermally Cured
  • Good Reliability
  • Compatible with Copper Plating
  • Excellent Thermal Conductivity
  • RoHS Compliant
  • Halogen-Free
 UVHP-100
  • UV Cure, One-Component Hole Fill Material
  • For Plated or Non-Plated Holes
  • Very Low Shrinkage
  • Compatible with Solder Mask Top Coat
  • RoHS Compliant
  • Halogen-Free
 
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